JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
SOT-23 Plastic-Encapsulate MOSFETs
2N7002K N-channel MOSFET
SOT-23
FEATURES
z
High density cell design for Low RDS(on)
z
Voltage controlled small signal switch
z
Rugged and reliable
z
High saturation current capability
z
ESD protected up to 2KV
Marking: 72K
MOSFET MAXIMUM RATINGS (Ta = 25°C unless otherwise noted)
Value
Units
60
V
VGS
Drain-Source voltage
Gate-Source voltage
ID
Drain Current
340
mA
PD
Power Dissipation
0.35
W
TJ
Junction Temperature
150
℃
Tstg
Storage Temperature
-55-150
℃
RθJA
Thermal Resistance fromJunction to Ambient
357
℃ /W
Symbol
VDS
Parameter
20
1. GATE
2. SOURCE
3. DRAIN
Equivalent circuit
V
MOSFET ELECTRICAL CHARACTERISTICS (Ta=25℃ unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
Static Characteristics
Drain-Source Breakdown Voltage
Gate Threshold Voltage*
Zero Gate Voltage Drain Current
Gate –Source leakage current
Drain-Source On-Resistance*
VDS
VGS = 0V, ID =250µA
60
VGS(th)
VDS =VGS, ID =1mA
1
IDSS
VDS =48V,VGS = 0V
IGSS1
V
2.5
V
1
µA
VGS =±20V, VDS = 0V
±10
µA
IGSS2
VGS =±10V, VDS = 0V
±200
nA
IGSS3
VGS =±5V, VDS = 0V
±100
nA
5.3
Ω
5
Ω
1.5
V
RDS(on)
VGS = 4.5V, ID =200mA
VGS =10V,ID =500mA
Diode Forward Voltage
VSD
VGS=0V, IS=300mA
Recovered charge
Qr
VGS=0V,IS=300mA,VR=25V,
dls/dt=-100A/µS
30
nC
Dynamic Characteristics**
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS =10V,VGS =0V,f =1MHz
40
pF
30
pF
10
pF
10
ns
15
ns
Switching Characteristics**
Turn-On Delay Time
td(on)
Turn-Off Delay Time
td(off)
Reverse recovery Time
trr
VGS=10V,VDD=50V,RG=50Ω,
RGS=50Ω, RL=250Ω
VGS=0V,IS=300mA,VR=25V,
dls/dt=-100A/µS
30
ns
GATE-SOURCE ZENER DIODE
Gate-Source Breakdown Voltage
BVGSO
Igs=±1mA (Open Drain)
Notes :
*Pulse Test : Pulse Width ≤300µs, Duty Cycle ≤2%.
**These parameters have no way to verify.
±21.5
±30
V
B,Apr,2014
Typical Characteristics
2N7002K
Transfer Characteristics
Output Characteristics
1.0
1.0
Ta=25℃
VGS=10,7,6,5V
0.8
Pulsed
0.8
(A)
(A)
VGS=4V
ID
ID
0.6
DRAIN CURRENT
DRAIN CURRENT
Ta=25℃
Pulsed
0.4
VGS=3V
0.2
0.0
0.6
0.4
0.2
0
1
2
3
4
DRAIN TO SOURCE VOLTAGE
RDS(ON)
——
10
VDS
0.0
5
0
(V)
1
2
3
4
GATE TO SOURCE VOLTAGE
RDS(ON)
ID
——
10
VGS
5
VGS
Ta=25℃
Ta=25℃
Pulsed
Pulsed
8
( )
RDS(ON)
6
ON-RESISTANCE
RDS(ON)
( )
8
ON-RESISTANCE
6
(V)
4
VGS=4.5V
2
6
ID=500mA
4
2
VGS=10V
0
0
200
400
600
DRAIN CURRENT
IS
10
——
800
ID
1000
1200
0
0
2
4
6
GATE TO SOURCE VOLTAGE
(mA)
8
VGS
10
(V)
VSD
Ta=25℃
Pulsed
SOURCE CURRENT
IS
(A)
1
0.1
0.01
1E-3
0.0
0.5
1.0
1.5
SOURCE TO DRAIN VOLTAGE
2.0
VSD
2.5
3.0
(V)
B,Apr,2014
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions In Millimeters
Min
Max
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950 TYP
1.800
2.000
0.550 REF
0.300
0.500
0°
8°
Dimensions In Inches
Min
Max
0.035
0.045
0.000
0.004
0.035
0.041
0.012
0.020
0.003
0.006
0.110
0.118
0.047
0.055
0.089
0.100
0.037 TYP
0.071
0.079
0.022 REF
0.012
0.020
0°
6°
B,Apr,2014
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